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Increasing IT chip densities, a focus on energy efficiency, and new IT use cases like harsh edge computing environments are driving the interest and adoption of liquid cooling.
In this paper we present the fundamentals of liquid cooling, describe the advantages over conventional air cooling, and explain the 5 main direct to chip and immersive methods.
To help guide the selection of the appropriate liquid cooling method for a given need, we explain the key attributes that must be considered.
Introduction to the white paper
IT equipment technology change has always been a primary driver in the development of infrastructure cooling solutions. Although liquid cooling has been deployed for many years in mainframes and high-performance computing (HPC), today’s demands of cloud, IoT, AI, and edge applications are once again resulting in IT technology changes which is forcing a renewed look at liquid cooling and the development of new technologies. Increasing focus on data center energy efficiency and sustainability is also placing increased pressure on the data center industry to develop and adopt efficient cooling infrastructure like liquid cooling. White Paper 279, Five Reasons to Adopt Liquid Cooling, describes the reasons to consider this technology.
Data center owners and designers often have fundamental questions about liquid cooling, such as:
- Why is liquid cooling better than air cooling in transferring heat energy?
- What are the types of liquid cooling solutions?
- What are the benefits and drawbacks of each method of liquid cooling?
- What kind of critieria should I use to choose between different liquid cooling technologies?
In this paper, we answer these questions, and provide guidance in selecting an appropriate liquid cooling method for your application.
This white paper is available to download here.